Qaybaha Elektarooniga ah IC Chips Isku-dhafka Wareegyada Adeegga BOM TPS4H160AQPWPRQ1
Sifooyinka Alaabta
| NOOCA | SHARAXA |
| Qaybta | Wareegyada isku dhafan (ICs) |
| Mfr | Qalabka Texas |
| Taxane | Gawaarida, AEC-Q100 |
| Xidhmada | Cajalad & Gariir (TR) Jaran Cajalad (CT) Digi-Reel® |
| SPQ | 2000T&R |
| Xaaladda Alaabta | Firfircoon |
| Nooca beddelka | Ujeedada Guud |
| Tirada Waxsoosaarka | 4 |
| Saamiga - Gelida: Wax-soo-saarka | 1:1 |
| Habaynta wax soo saarka | Dhinaca Sare |
| Nooca wax soo saarka | N-Channel |
| Interface | Dami/Dami |
| Voltage - Load | 3.4V ~ 40V |
| Korantada - Alaabta (Vcc/Vdd) | Looma baahna |
| Hadda - Wax-soo-saarka (Max) | 2.5A |
| Rds On (Nooca) | 165mOhm |
| Nooca Gelitaanka | Aan leexleexad lahayn |
| Astaamaha | Calanka heerka |
| Ilaalinta qaladka | Xadaynta Hadda (Go'an), Heerkulka Sare |
| Heerkulka shaqada | -40°C ~ 125°C (TA) |
| Nooca Koritaanka | Dusha sare |
| Xidhmada Aaladda Bixiyaha | 28-HTSSOP |
| Xidhmada / Kiis | 28-PowerTSSOP (0.173 ", ballac 4.40mm) |
| Lambarka Alaabta Saldhigga | TPS4H160 |
Xiriirka ka dhexeeya wafers iyo chips
Chip wuxuu ka kooban yahay wax ka badan aaladaha N semiconductor Semiconductor guud ahaan waa diodes triodes field effect tuubooyinka yar yar ee iska caabbinta inductors capacitors iwm.
Waa isticmaalka habab farsamo si loo beddelo fiirsashada ee electrons lacag la'aanta ah ee nucleus-ka atomiga ceel wareeg ah si loo beddelo sifooyinka jireed ee nucleus-ka si loo soo saaro lacag togan ama taban oo ah kuwa badan (elektarooni) ama dhowr (god) samee semiconductors kala duwan.
Silikoon iyo germanium waxaa inta badan loo adeegsadaa agabka semiconductor-ka, hantidooda iyo agabkooduna si fudud oo raqiis ah ayaa loo heli karaa tiro badan si loogu isticmaalo tignoolajiyadan.
Waferka silikon wuxuu ka kooban yahay tiro badan oo ah aaladaha semiconductor.Shaqada waferku waa, dabcan, in la sameeyo wareeg ka soo baxa semiconductors kuwaas oo ku jira waferka sida loo baahan yahay.
Xiriirka ka dhexeeya wafers iyo chips - inta wafers ayaa ku jira jajab
Tani waxay kuxirantahay cabbirka dhimashadaada, cabbirka waferkaaga, iyo heerka waxsoosaarka.
Waqtigan xaadirka ah, wershadaha waxa loogu yeero 6, 12 "ama 18" wafers waa gaaban yihiin dhexroorka wafer, laakiin inches waa qiyaas. Dhexroorka wafer-ka dhabta ah waxaa loo qaybiyaa 150mm, 300mm iyo 450mm, iyo 12" waxay la mid tahay 305mm , sidaas darteed waxaa loogu yeeraa 12" wafer si ay ugu habboonaato.
Wafer dhamaystiran
Sharaxaad: Wafer waa wafer-ka sawirka ka muuqda wuxuuna ka samaysan yahay silikoon saafi ah (Si).Wafer-ku waa qayb yar oo ka mid ah waferka silikoon, oo loo yaqaan geeri, taas oo loo baakadeeyey sidii pellet.Waferka ay ku jiraan waferka Nand Flash, maraqa marka hore waa la gooyaa, ka dib waa la tijaabiyaa waxaana la saarayaa dhinta, xasiloon, awood buuxdana waa laga saarayaa oo la baakadeeyay si ay u sameeyaan Nand Flash chip oo aad aragto maalin kasta.
Waxa ku hadhaa waferka ayaa markaa ah mid aan degganayn, qayb ahaan dhaawacday, oo sidaas awgeed awood yar, ama gebi ahaanba burburtay.Soo saaraha asalka ah, iyada oo tixgelinaysa hubinta tayada, ayaa ku dhawaaqi doonta kuwa dhintay oo si adag u qeexaya inay yihiin qashinka wadarta qashinka.
Xidhiidhka ka dhexeeya dhimashada iyo waferka
Ka dib marka dhinta la gooyo, wafer-kii asalka ahaa wuxuu noqdaa waxa ka muuqda sawirka hoose, kaas oo ah Downgrade Flash Wafer ka hadhay.
Wafer la baadhay
Dhimashadan hadhaaga ahi waa wafers heerkoodu hooseeyo.Qaybta la saaray, qaybta madow, waa dhimashadii u qalma waxaana la baakadeyn doonaa oo ka dhigi doona NAND pellets oo dhammaatay oo uu sameeyay soo saaraha asalka ah, halka qaybta aan u qalmin, qaybta ku hadhay sawirka, loo tuuri doono sidii qashinka.
