XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Macluumaadka Alaabta
| NOOCBlocks Logic: | 2586150 |
| Tirada Macrocells: | 2586150Macrocells |
| Qoyska FPGA: | Virtex UltraScale Taxanaha |
| Habka Kiiska macquulka ah: | FCBGA |
| Tirada biinanka: | 2104Biinanka |
| Tirada. Fasalada Xawaaraha: | 2 |
| Wadarta xajmiyada RAM: | 77722Kbit |
| Tirada I/O's: | 778I/O's |
| Maareynta Saacadaha: | MMCM, PLL |
| Ugu yaraan Supply Voltage: | 922mV |
| Korontada Supply Core Max: | 979mV |
| Qulqulka I/O Supply: | 3.3V |
| Inta ugu badan ee shaqaynaysa: | 725Mhz |
| Baaxadda Alaabta: | Virtex UltraScale XCVU9P |
| MSL: | - |
Hordhac Product
BGA waxay u taagan tahayXirmada Isku Array Ball Grid.
Xusuusta ay ku duuban tahay tignoolajiyada BGA waxay kordhin kartaa awoodda xusuusta ilaa saddex jeer iyada oo aan la beddelin mugga xusuusta, BGA iyo TSOP
Marka la barbardhigo, waxay leedahay mug yar, waxqabadka kulaylka wanaagsan iyo waxqabadka korantada.Tiknoolajiyada baakadaha BGA ayaa si weyn u wanaajisay awoodda kaydinta halkii inch ee labajibbaaran, iyadoo la adeegsanayo alaabada xusuusta tignoolajiyada baakadaha BGA ee hoos yimaada awoodda isku midka ah, mugga ayaa ah saddex-meelood meel oo keliya baakooyinka TSOP;Waxaa dheer, oo leh dhaqan
Marka la barbar dhigo xirmada TSOP, xirmada BGA waxay leedahay hab kuleyl degdeg ah oo waxtar leh.
Iyadoo horumarinta tiknoolajiyada isku-dhafka ah ee isku-dhafka ah, shuruudaha baakadaha ee wareegyada isku-dhafka ah ayaa aad u adag.Tani waa sababta oo ah tikniyoolajiyadda baakaduhu waxay la xiriirtaa shaqeynta alaabta, marka inta jeer ee IC ay dhaafto 100Mhz, habka baakadaha dhaqameed wuxuu soo saari karaa waxa loogu yeero "Cross Talk• ifafaale, iyo marka tirada biinanka ee IC ay tahay In ka badan 208 Pin, habka baakadaha dhaqameedku dhibaato ayuu leeyahay.Sidaa darteed, isticmaalka baakadaha QFP ka sokow, inta badan maanta chips-yada tirada sare ee pin-tirinta (sida chips chips iyo chipsets, iwm) waxaa loo beddelaa BGA(Ball Grid Array). PackageQ) Tignoolajiyada baakaynta.Markii ay BGA soo muuqatay, waxay noqotay doorashada ugu fiican ee cufnaanta sare, waxqabadka sare, xirmooyinka pin-badan sida cpus iyo koonfurta/waqooyiga buundada ee Motherboard-yada.
Tignoolajiyada baakadaha BGA waxa kale oo loo qaybin karaa shan qaybood:
1.PBGA (Plasric BGA): Guud ahaan 2-4 lakab oo walxo organic ah oo ka kooban guddi lakabyo badan.Intel taxanaha CPU, Pentium 1l
Soo-saareyaasha Chuan IV dhamaantood waa lagu baakadeeyay foomkan.
2.CBGA (CeramicBCA) Substrate: taas oo ah, substrate dhoobada, xidhiidhka korantada ee u dhexeeya chip-ka iyo substrate-ka inta badan waa flip-chip
Sida loo rakibo FlipChip (FC gaaban).Intel Series cpus, Pentium l, ll Pentium Pro Processor ayaa la isticmaalaa
Nooc ka mid ah duubista.
3.FCBGA(FilpChipBGA) Substrate: Substrate-lakab badan oo adag.
4.TBGA (TapeBGA) substrate: Substrate-ku waa ribbon jilicsan 1-2 lakabka PCB wareegga wareegga.
5.CDPBGA (Carty Down PBGA) substrate: waxaa loola jeedaa aagga chip square hoose ee hoose (sidoo kale loo yaqaan aagga godka) ee bartamaha xirmada.
Xirmada BGA waxay leedahay sifooyinka soo socda:
1.10 Tirada biinanka waa la kordhiyey, laakiin masaafada u dhaxaysa biinanka ayaa aad uga weyn tan baakadaha QFP, taas oo wanaajisa wax soo saarka.
2) .In kasta oo isticmaalka korantada ee BGA la kordhiyo, waxqabadka kuleylka korantada waa la hagaajin karaa sababtoo ah habka alxanka jajabka ee la xakameeyey.
3).Daahitaanka gudbinta calaamaduhu waa yar yahay, iyo inta jeer ee la qabsiga si weyn ayaa loo hagaajiyay.
4).Shirku wuxuu noqon karaa alxanka coplanar, kaas oo si weyn u wanaajinaya isku halaynta.
