Semicon Microcontroller Voltage regulator IC Chips TPS62420DRCR SON10 Qalabka Elektrooniga ah ee adeega liiska BOM

Fikradda xirmada:

Dareen cidhiidhi ah: Habka habaynta, dhejinta, iyo isku xirka chips iyo walxo kale oo ku yaala fareemka ama substrate iyadoo la adeegsanayo tikniyoolajiyada filimka iyo farsamooyinka microfabrication, taasoo horseedaysa terminal iyo hagaajinta iyaga oo ku dhejinaya dhexdhexaad dhexdhexaad ah oo jilicsan si loo sameeyo qaab dhismeed saddex-cabbir ah.

Si ballaaran u hadla: habka isku xirka iyo hagaajinta xirmada substrate, isu geynta nidaam dhamaystiran ama qalab elektaroonik ah, iyo hubinta waxqabadka guud ee nidaamka oo dhan.

Hawlaha lagu gaaro baakadaha chip.

1. wareejinta hawlaha;2. wareejinta calaamadaha wareegga;3. bixinta habka kulaylka;4. ilaalinta dhismaha iyo taageerada.

Heerka farsamada ee injineernimada baakadaha.

Injineernimada baakadu waxay bilaabataa ka dib marka la sameeyo chip IC oo ay ku jiraan dhammaan hababka ka hor inta aan la dhejin IC chip-ka oo la dhejiyo, isku xiran, la daboolay, la xiray oo la ilaaliyo, oo lagu xiro guddiga wareegga, iyo nidaamka waa la isku dhejiyaa ilaa alaabta ugu dambeysa la dhammeeyo.

Heerka koowaad: sidoo kale loo yaqaan baakadaha heerka chip, waa habka hagaajinta, isku xidhka, iyo ilaalinta chip IC ee baakadaha substrate ama qaabka rasaasta, taas oo ka dhigaysa cutub (urur) qayb si fudud loo qaadi karo loona rari karo laguna xidhi karo ilaa heerka xiga ee golaha.

Heerka 2: Habka isku darka dhowr xirmo oo ka socda heerka 1 iyo qaybaha kale ee elektiroonigga ah si loo sameeyo kaarka wareegga.Heerka 3: Habka isku darka dhowr kaarar wareeg ah oo laga soo ururiyey baakado lagu dhammeeyey heerka 2 si loo sameeyo qayb ama nidaam hoose oo ka mid ah guddiga weyn.

Heerka 4: Habka isku-dubbarididda dhowr nidaam-hoosaadyo oo laga dhigayo badeecad elektaroonik ah oo dhammaystiran.

In chip.Habka isku xirka qaybaha wareegga isku dhafan ee jajabka waxaa sidoo kale loo yaqaannaa baakadaha heerka eber, sidaas awgeed injineernimada baakadaha ayaa sidoo kale lagu kala saari karaa shan heer.

Kala soocidda baakooyinka:

1, marka loo eego tirada chips IC ee xirmada: hal baakad chip (SCP) iyo xirmo-chip badan (MCP).

2, iyadoo loo eegayo kala soocidda walxaha shaabadda: Qalabka polymer (caag) iyo dhoobada.

3, marka loo eego qalabka iyo habka isku xirka guddiga wareegga: nooca gelinta pin (PTH) iyo nooca buurta dusha sare (SMT) 4, sida ku cad foomka qaybinta pin: biinanka hal dhinac ah, biinanka laba-geesoodka ah, biinanka afar-geesoodka ah, iyo biinanka hoose.

Aaladaha SMT waxay leeyihiin biinanka nooca L, nooca J, iyo nooca I.

SIP: xirmo hal saf ah SQP: xirmo yar yar MCP: xirmo dheri bir ah DIP: xirmo laba saf ah CSP: xirmo cabbirka jajabka QFP: xirmo guri afar gees leh PGA: xirmo matrix dhibco ah BGA: xirmo grid grid LCCC: sidaha dhoobada dhoobada ah ee aan hogaanka lahayn