Asalka IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA
Sifooyinka Alaabta
| NOOCA | SHEEG |
| qaybta | Wareegyada isku dhafan (ICs) |
| soo saaraha | |
| taxane | |
| duub | badan |
| Heerka badeecada | Firfircoon |
| DigiKey waa barnaamij | Lama xaqiijin |
| Lambarka LAB/CLB | 18180kii |
| Tirada walxaha macquulka ah / cutubyada | 318150 |
| Wadarta tirada xajmiyada RAM | 13004800 |
| Tirada I/Os | 312 |
| Voltage - Korontada | 0.922V ~ 0.979V |
| Nooca rakibidda | |
| Heerkulka shaqada | -40°C ~ 100°C (TJ) |
| Xidhmada/Guryaynta | |
| Qaybta iibiyaha | 1156-FCBGA (35x35) |
| nambarka sayidka alaabta |
Dukumentiyada & Warbaahinta
| NOOCA kheyraadka | XIRIIRKA |
| Xaashida xogta | |
| Macluumaadka deegaanka | Xiliinx RoHS Cert |
| Naqshadeynta/qeexidda PCN |
Kala-soocidda sifooyinka deegaanka iyo dhoofinta
| sifada | SHEEG |
| Heerka RoHS | U hoggaansanaanta dardaaranka ROHS3 |
| Heerka Dareenka Humidity (MSL) | 4 (72 saacadood) |
| Heerka GAAR | Ma hoos imanayo qeexida REACH |
| ECN | 3A991D |
| HTSUS | 8542.39.0001 |
Hordhac Product
FCBGA(Flip Chip Ball Grid Array) waxay u taagan tahay "kubbada kubbadda shaxanka Array".
Flip-BGATignoolajiyadan baakaduhu waxay bilaabatay 1960-meeyadii, markii IBM ay soo saartay tignoolajiyada loo yaqaan C4 (Controlled Collapse Chip Connection) ee isku xidhka kombuyuutarrada waaweyn, ka dibna waxay sii horumarisay si ay u adeegsato xiisadda dusha sare ee qulqulka dhalaalaysa si ay u taageerto miisaanka chip-ka. oo xakamee dhererka bararka.Oo noqo jihada horumarinta tignoolajiyada flip.
Waa maxay faa'iidooyinka FC-BGA?
Marka hore, way xallisaawaafaqsanaanta korantada(EMC) iyoFaragelinta korantada (EMI)dhibaatooyinka.Guud ahaan, gudbinta calaamadda chip-ka iyadoo la adeegsanayo tignoolajiyada baakadaha WireBond waxaa lagu fuliyaa silig bir ah oo leh dherer gaar ah.Xaaladda soo noqnoqoshada sare, habkani wuxuu soo saari doonaa waxa loogu yeero saamaynta impedance, samaynta caqabad ku ah jidka calaamadda.Si kastaba ha ahaatee, FC-BGA waxay isticmaashaa pellets halkii ay ka isticmaali lahayd biinanka si ay ugu xirto processor-ka.Xidhmadani waxay isticmaashaa wadar ahaan 479 kubbadood, laakiin mid kastaa wuxuu leeyahay dhexroor 0.78 mm, taas oo bixisa masaafada ugu gaaban ee xidhiidhka dibadda.Isticmaalka xirmadan kaliya ma bixiso wax qabad koronto oo heer sare ah, laakiin sidoo kale waxay yaraynaysaa lumitaanka iyo isdhexgalka u dhexeeya qaybaha isku-xidhka, waxay yaraynaysaa dhibaatada faragelinta korantada, waxayna u adkeysan kartaa soo noqnoqoshada sare, jebinta xadka xad dhaafka ah waxay noqotaa suurtagal.
Marka labaad, maaddaama naqshadeeyayaasha soo-bandhigidda soo-bandhigidda ay ku dhejiyaan wareegyo cufan oo badan oo isku mid ah isla aagga silikoon, tirada wax-soo-saarka iyo wax-soo-saarka iyo biinanka ayaa si degdeg ah u kordhi doona, iyo faa'iidada kale ee FC-BGA waa inay kordhin karto cufnaanta I/O .Guud ahaan, I/O hogaamiyayaasha isticmaalaya tignoolajiyada WireBond waxaa lagu habeeyaa hareeraha chip-ka, laakiin ka dib xirmada FC-BGA, hogaanka I/O waxaa lagu habayn karaa si toos ah dusha sare ee chip-ka, taasoo bixisa cufnaanta sare ee I/O qaabeynta, taasoo keentay waxtarka isticmaalka ugu fiican, iyo sababta oo ah faa'iidadan.Tiknoolajiyada rogantaa waxay hoos u dhigtaa aagga 30% ilaa 60% marka loo eego foomamka baakadaha dhaqameed.
Ugu dambeyntii, jiilka cusub ee xawaaraha sare leh, jajabyada bandhiga ee isku dhafan, dhibaatada kuleylka kuleylka ayaa noqon doonta caqabad weyn.Iyada oo ku saleysan qaabka xirmada rogan ee gaarka ah ee FC-BGA, dhabarka dambe ee jajabku wuxuu soo bandhigi karaa hawada wuxuuna si toos ah u baabi'in karaa kulaylka.Isla mar ahaantaana, substrate-ku wuxuu sidoo kale wanaajin karaa waxtarka kuleylka kulaylka iyada oo loo marayo lakabka birta, ama ku dheji birta kulaylka kuleyliyaha gadaasha jilibka, sii xoojinta awoodda kuleylka kuleylka, oo si weyn u wanaajiso xasilloonida jajabka. hawlgal xawaare sare leh.
Faa'iidooyinka xirmada FC-BGA awgeed, ku dhawaad dhammaan jajabyada kaadhadhka dardargelinta garaafyada waxaa lagu soo xiraa FC-BGA.
