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alaabta

XCZU19EG-2FFVC1760E 100% Cusub & Asalka DC U Beddelaya Chip

sharaxaad gaaban:

Qoyskan alaabtu waxay isku daraan qaab-dhismeedka qani ku ah 64-bit quad-core ama dual-core Arm® Cortex®-A53 iyo dual-core Arm Cortex-R5F nidaamka processing ku salaysan (PS) iyo barnaamijka macquulka ah (PL) UltraScale architecture ee hal hal qalab.Waxa kale oo ka mid ah xusuusta-chip-ka, is-dhexgallada xusuusta dibadda ah, iyo qaybo badan oo isku-xirnaanta durugsan.


Faahfaahinta Alaabta

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Sifooyinka Alaabta

Sifada alaabta Qiimaha sifada
Soo saaraha: Xilinx
Qaybta Alaabta: SoC FPGA
Xayiraadaha rarka: Alaabtani waxay u baahan kartaa dukumeenti dheeri ah si looga dhoofiyo Maraykanka.
RoHS:  Faahfaahin
Habka Koritaanka: SMD/SMT
Xidhmada / Kiis: FBGA-1760
Muhiim: ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Tirada Koofiyado: 7 Core
Inta ugu badan ee saacada: 600 MHz, 667 MHz, 1.5 GHz
Xusuusta Tilmaamaha Cache ee L1: 2 x 32 kB, 4 x 32 kB
Kaydka Xogta L1: 2 x 32 kB, 4 x 32 kB
Cabbirka Xusuusta Barnaamijka: -
Cabbirka Xogta RAM: -
Tirada walxaha macquulka ah: 1143450 LE
Hababka macquulka ah ee La qabsiga - ALMs: 65340 ALM
Xusuusta Ku Dadan: 34.6 Mbt
Ku shaqaynta korontada 850mV
Heerkulka Shaqaynta Ugu Yar: 0 C
Heerkulka shaqada ee ugu badan: + 100 C
Summada: Xilinx
RAM la qaybiyay: 9.8 Mbt
RAM-Blocked-EBR: 34.6 Mbt
Qoyaanka xasaasiga ah: Haa
Tirada blocks Array Logic - LABs: 65340 LAB
Tirada Transceivers: 72 Transceiver
Nooca Alaabta: SoC FPGA
Taxane: XCZU19EG
Tirada Xidhmada Warshada: 1
Qayb-hoosaad: SOC - Nidaamyada Chip
Magaca ganacsiga: Zynq UltraScale+

Nooca Wareegga Isku-dhafan

Marka la barbar dhigo elektarooniga, photon-yadu ma laha cuf fadhiid ah, is dhexgal daciif ah, awood xoog leh oo ka hortagga faragelinta, waxayna aad ugu habboon yihiin gudbinta macluumaadka.Isku xirka indhaha ayaa la filayaa inuu noqdo tignoolajiyada udub-dhexaadka u ah inay jabiso gidaarka isticmaalka tamarta, gidaarka kaydinta iyo gidaarka isgaarsiinta.Iftiiminta, lammaane, modulator, aaladaha waveguide ayaa lagu dhex daray astaamaha cufnaanta sare ee indhaha sida nidaamka micro-electric isku-dhafan, waxay xaqiijin karaan tayada, mugga, isticmaalka awoodda is-dhexgalka sawir-qaadista cufnaanta sare, madal is-dhexgalka sawir-qaadista oo ay ku jiraan III - V-ka kooban semiconductor monolithic (INP) ) madal is dhexgalka dadban, silicate ama galaas (planar waveguide, PLC) iyo madal silikoon ku salaysan.

Madal InP waxaa inta badan loo isticmaalaa soo saarista laser, modulator, detector iyo aaladaha kale ee firfircoon, heerka tignoolajiyada hoose, qiimaha substrate sare;Isticmaalka madal PLC si loo soo saaro qaybo dadban, khasaaro yar, mug weyn;Dhibaatada ugu weyn ee labada gooboodba waa in alaabtu aysan ku habboonayn qalabka elektarooniga ah ee silicon-ku salaysan.Faa'iidada ugu caansan ee is-dhexgalka photonic-ku-saleysan ee silikoon waa in geeddi-socodku uu la jaan-qaadi karo habka CMOS iyo kharashka wax-soo-saarku waa mid hooseeya, sidaas darteed waxaa loo tixgeliyaa inuu yahay habka ugu macquulsan ee optoelectronic iyo xitaa dhammaan nidaamka is-dhexgalka indhaha.

Waxaa jira laba hab oo isdhexgalka oo loogu talagalay aaladaha sawir-qaadista ee silikoon ku saleysan iyo wareegyada CMOS.

Faa'iidada tan hore ayaa ah in aaladaha sawir-qaadista iyo aaladaha elektiroonigga ah si gaar ah loo hagaajin karo, laakiin xirmooyinka xiga waa adag tahay codsiyada ganacsiguna waa xaddidan yihiin.Tan dambe way adag tahay in la qaabeeyo oo la farsameeyo isku dhafka labada qalab.Waqtigan xaadirka ah, isku-dhafka isku-dhafka ah ee ku salaysan is-dhexgalka walxaha nukliyeerka ayaa ah doorashada ugu fiican


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