Sifooyinka Alaabta

Intel ayaa daaha ka qaaday tafaasiisha 3D chip-ka: awood u leh in ay soo dhejiso 100 bilyan oo transistor ah, waxay qorsheyneysaa inay bilowdo 2023

Chip-ka la dulsaaray ee 3D waa jihada cusub ee Intel si ay uga hortimaado Sharciga Moore iyadoo la isku dhejinayo qaybaha macquulka ah ee chip-ka si ay si weyn u kordhiso cufnaanta CPU-yada, GPU-yada, iyo soo-saareyaasha AI.Iyadoo hababka chip-ku uu ku soo dhawaado joogsi, tani waxay noqon kartaa habka kaliya ee lagu sii wanaajin karo waxqabadka.

Dhawaan, Intel waxay soo bandhigtay faahfaahin cusub oo ku saabsan naqshadeeda 3D Foveros chip ee soo socota ee Meteor Lake, Arrow Lake, iyo Chips Lake Lunar ee shirka warshadaha semiconductor Hot Chips 34.

Xanta dhawaanahan ayaa soo jeedinaysay in Intel's Meteor Lake dib loo dhigi doono sababtoo ah baahida loo qabo in Intel GPU tile/chipset laga beddelo noodhka TSMC 3nm loona beddelo noodhka 5nm.In kasta oo Intel aysan wali la wadaagin macluumaadka ku saabsan noodhka gaarka ah ee ay u isticmaali doonto GPU-da, wakiil shirkadeed ayaa sheegay in noodhka la qorsheeyay ee qaybta GPU-da aanu is beddelin oo uu processor-ku ku socdo waddadii lagu sii deyn lahaa wakhtiga loogu talagalay 2023.

Waxaa xusid mudan, markan Intel waxa ay soo saari doontaa oo keliya mid ka mid ah afarta qaybood (qaybta CPU) ee loo isticmaalo in lagu dhiso chips-keeda Meteor Lake - TSMC ayaa soo saari doonta saddexda kale.Ilaha warshadaha ayaa tilmaamaya in tile GPU uu yahay TSMC N5 (nidaamka 5nm).

Intel ayaa la wadaagay sawiradii ugu dambeeyay ee processor-ka Meteor Lake, kaas oo isticmaali doona habka Intel 4 ee habka loo yaqaanno (7nm process) wuxuuna marka hore suuqa ku soo gali doonaa processor-ka mobilada oo leh lix koor oo waaweyn iyo laba koor oo yaryar.Harada Meteor iyo Chips-ka harada Arrow waxay daboolaysaa baahida suuqyada mobilada iyo kombuyutarka PC, halka harada Lunar loo isticmaali doono buugaag khafiif ah oo khafiif ah, oo daboolaya 15W iyo suuqa ka hooseeya.

Horumarrada laga sameeyay baakadaha iyo isku xidhka isku xidhka ayaa si degdeg ah u beddelaya wejiga soo-saareyaasha casriga ah.Labaduba hadda waxay muhiim u yihiin sida tignoolajiyada noodhka nidaamka hoose - iyo si macquul ah uga muhiimsan siyaabaha qaarkood.

Qaar badan oo ka mid ah shaacinta Intel Isniintii ayaa diiradda saarey tignoolajiyada baakadaha ee 3D Foveros, taas oo loo isticmaali doono saldhig u ah warshadaheeda Meteor Lake, Arrow Lake, iyo Lunar Lake ee suuqa macaamiisha.Farsamadani waxay u oggolaanaysaa Intel inay si toosan ugu dhejiso jajabyada yaryar chips-ka midaysan oo leh isku-xidhka Foveros.Intel waxay sidoo kale u adeegsaneysaa Foveros Ponte Vecchio iyo Rialto Bridge GPUs iyo Agilex FPGAs, marka waxaa loo tixgelin karaa tignoolajiyada hoose ee dhowr ka mid ah badeecadaha soo socda ee shirkadda.

Intel waxay hore u soo bandhigtay 3D Foveros si ay ugu iibiso soosaarkeeda Lakefield ee mugga yar, laakiin 4-tile Meteor Lake iyo ku dhawaad ​​​​50-tile Ponte Vecchio ayaa ah chips-kii ugu horreeyay ee shirkadda ee lagu sameeyo tignoolajiyada.Ka dib Arrow Lake, Intel waxay u gudbi doontaa isku xirka cusub ee UCI, kaas oo u oggolaanaya inay gasho nidaamka deegaanka chipset-ka iyadoo la adeegsanayo is-dhexgal heersare ah.

Intel ayaa daaha ka qaaday inay dhigi doonto afar Chipset-ka Meteor Lake (oo loo yaqaan "tiles/tiles" ee luqadda Intel) korka sare ee lakabka dhexe ee Foveros / tile base.Dusha sare ee harada Meteor way ka duwan tahay ta Lakefield, taas oo loo tixgelin karo SoC dareen ahaan.Farsamaynta baakadaha 3D Foveros sidoo kale waxay taageertaa lakab dhexdhexaad ah oo firfircoon.Intel waxa ay sheegtay in ay adeegsato habraac 22FFL oo qiimo jaban iyo awood yar leh (oo la mid ah Lakefield) si ay u soo saarto lakabka dhexda ee Foveros.Intel waxa kale oo ay bixisaa nooc cusub oo 'Intel 16' ah oo ka mid ah noodhkan adeegyadeeda aasaaska, laakiin ma cadda nooca foornada saldhigga Meteor Lake Intel ay isticmaali doonto.

Intel waxay ku rakibi doontaa modules-ka xisaabinta, I/O blocks, SoC blocks, iyo blocks garaafyada (GPUs) iyadoo adeegsanaysa Intel 4 ee lakabkan dhexe.Dhammaan cutubyadan waxaa naqshadeeyay Intel waxayna adeegsadaan qaab-dhismeedka Intel, laakiin TSMC waxay OEM-yada I/O, SoC, iyo GPU-ga ku dhex sameyn doontaa.Tani waxay ka dhigan tahay in Intel uu soo saari doono oo keliya CPU iyo Foveros blocks.

Ilaha warshadaha ayaa daadanaya in I/O dhimanayaan iyo SoC lagu sameeyay habka TSMC ee N6, halka tGPU ay isticmaasho TSMC N5.(Waxaa xusid mudan in Intel ay u tixraacdo I/O tile sida 'I/O Expander', ama IOE)

Noodhadhka mustaqbalka ee khariidadda waddada Foveros waxaa ka mid ah 25 iyo 18-micron garoomo.Intel ayaa sheegay in xitaa aragti ahaan ay suurtogal tahay in la gaaro 1-micron bump fog mustaqbalka iyadoo la adeegsanayo Hybrid Bonded Interconnects (HBI).