Qalabka elektiroonigga ah ee ic chip Taageerada Adeegga BOM TPS54560BDDAR nooc cusub oo ah chips-ka elektiroonigga ah

1.Magacaabista IC, aqoonta guud ee xirmada iyo xeerarka magac bixinta:

Kala duwanaanta heerkulka

C=0°C ilaa 60°C (darajada ganacsiga);I=-20°C ilaa 85°C (darajada warshadaha);E=-40°C ilaa 85°C (darajada warshadaha ee la fidiyey);A=-40°C ilaa 82°C (darajada hawada sare);M=-55°C ilaa 125°C (darajo ciidan)

Nooca xirmada.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic dusha sare ee naxaasta;E-QSOP;F-Seramic SOP;H- SBGAJ-Seramic DIP;K-TO-3;L-LCC, M-MQFP;N-DIP cidhiidhi ah;N-DIP;Q PLCC;R - DIP dhoobada cidhiidhiga ah (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Factor Foom yar oo Balaadhan (300mil) W-Wide qaab yar yar (300 mil);X-SC-60 (3P, 5P, 6P);Y-korka naxaasta ah ee cidhiidhiga ah;Z-TO-92, MQUAD;D-Die;/ PR-Balaastig la xoojiyay;/W-Wafer.

Tirada biinanka:

a-8;b-10;c-12, 192;d-14;e-16;f-22,256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (wareeg);W-10 (wareeg);X-36;Y-8 (wareeg);Z-10 (wareeg).(wareeg).

Fiiro gaar ah: Xarafka ugu horreeya ee afarta xaraf ee daba-galka fasalka waa E, taas oo macnaheedu yahay in qalabku leeyahay function antistatic.

2.Horumarinta tignoolajiyada baakadaha

Wareegyadii ugu horreeyay ee isku-dhafan waxay adeegsadeen xirmooyin fidsan dhoobada ah, kuwaas oo ay sii wadeen inay isticmaalaan ciidamadu sannado badan sababtoo ah isku halaynta iyo cabbirkooda yar.Baakadaha wareegga ganacsiga ayaa isla markiiba u wareegay baakadaha laba-geesoodka ah, laga bilaabo dhoobada iyo ka dibna balaastiigga, iyo 1980-meeyadii tirooyinka pin ee wareegyada VLSI waxay dhaafeen xadka codsiga ee xirmooyinka DIP, ugu dambeyntiina waxay keentay soo ifbaxa arrays grid-ka iyo qalab-qaadayaasha chip.

Xirmada dusha sare waxay soo ifbaxday horraantii 1980-aadkii waxayna caan noqotay qaybtii danbe ee tobankaas sano.Waxay isticmaashaa biin-gaaban oo ka sii fiican waxayna leedahay baal-gull ama qaab biin-qaabeeya.Wareegga Isku-dhafka-Yar-yar (SOIC), tusaale ahaan, wuxuu leeyahay 30-50% aag ka yar waana 70% ka dhumuc yar DIP u dhiganta.Xirmadani waxay leedahay biinanka u qaabaysan baalka gull-ka oo ka soo baxay labada dhinac ee dheer iyo biin garoon ah 0.05".

Xirmooyinka Isku-dhafan ee Isku-dhafan-Yar-Outline (SOIC) iyo PLCC.1990-meeyadii, in kasta oo xirmada PGA ay wali inta badan loo isticmaali jiray microprocessors-dhamaadka sare.PQFP iyo xirmo khafiif ah oo yar yar (TSOP) ayaa noqday xirmada caadiga ah ee aaladaha tirinta biinanka sare.Microprocessors-yada sare ee Intel iyo AMD waxay ka guureen baakadaha PGA (Pine Grid Array) una guureen baakadaha Land Grid Array (LGA).

Xirmooyinka Ball Grid Array waxay bilaabeen inay soo baxaan 1970-meeyadii, 1990-meeyadiina xirmada FCBGA waxaa lagu sameeyay tiro biin ka sarreysa marka loo eego xirmooyinka kale.Xirmada FCBGA, dhimashadu kor iyo hoos ayaa loo rogaa waxaana lagu xidhaa kubbadaha alxanka ee xirmada lakabka aasaasiga ah ee PCB oo kale halkii fiilooyinka.Suuqa maanta, baakadu sidoo kale hadda waa qayb gaar ah oo ka mid ah geeddi-socodka, iyo tignoolajiyada xirmada waxay sidoo kale saameyn kartaa tayada iyo wax-soo-saarka alaabta.