Alaabta IC ee asalka ah ee asalka ah Qalabka Elektarooniga ah Ic Chip Taageerada Adeegga BOM TPS22965TDSGRQ1
Sifooyinka Alaabta
NOOCA | SHARAXA |
Qaybta | Wareegyada isku dhafan (ICs) |
Mfr | Qalabka Texas |
Taxane | Gawaarida, AEC-Q100 |
Xidhmada | Cajalad & Gariir (TR) Jaran Cajalad (CT) Digi-Reel® |
Xaaladda Alaabta | Firfircoon |
Nooca beddelka | Ujeedada Guud |
Tirada Waxsoosaarka | 1 |
Saamiga - Gelida: Wax-soo-saarka | 1:1 |
Habaynta wax soo saarka | Dhinaca Sare |
Nooca wax soo saarka | N-Channel |
Interface | Dami/Dami |
Voltage - Load | 2.5V ~ 5.5V |
Korantada - Alaabta (Vcc/Vdd) | 0.8V ~ 5.5V |
Hadda - Wax-soo-saarka (Max) | 4A |
Rds On (Nooca) | 16mOhm |
Nooca Gelitaanka | Aan leexleexad lahayn |
Astaamaha | Soo daynta Xamuulka, Qiimaha Dilalka waa la xakameeyay |
Ilaalinta qaladka | - |
Heerkulka shaqada | -40°C ~ 105°C (TA) |
Nooca Koritaanka | Dusha sare |
Xidhmada Aaladda Bixiyaha | 8-WSON (2x2) |
Xidhmada / Kiis | 8-WFDFN suuf qaawan |
Lambarka Alaabta Saldhigga | TPS22965 |
Waa maxay baakad
Nidaam dheer ka dib, laga bilaabo naqshadeynta ilaa wax soo saarka, waxaad ugu dambeyntii heleysaa chip IC.Si kastaba ha ahaatee, jilibku aad ayuu u yar yahay waana dhuuban yahay oo si fudud ayaa loo xoqi karaa oo waxyeello u geysan karaa haddii aan la ilaalin.Intaa waxaa dheer, cabbirka yar ee chip-ka awgeed, ma fududa in gacanta lagu dhejiyo sabuuradda iyada oo aan la helin guri weyn.
Sidaa darteed, sharaxaadda xirmada ayaa soo socota.
Waxaa jira laba nooc oo xirmo ah, xirmada DIP, oo sida caadiga ah laga helo alaabada koronto ku ciyaarto oo u eg centipede oo madow ah, iyo xirmada BGA, oo inta badan la helo marka la iibsanayo CPU ee sanduuqa.Hababka kale ee baakadaha waxaa ka mid ah PGA (Pin Grid Array; Pin Grid Array) ee loo isticmaalo CPU-yada hore ama nooca DIP ee la bedelay, QFP (xirmo guri labajibbaaran oo balaastik ah).
Sababtoo ah waxaa jira habab baakad badan oo kala duwan, kuwan soo socda ayaa sharxi doona xirmooyinka DIP iyo BGA.
Xirmooyinka dhaqameed ee soo jiray da'da
Xirmada ugu horreysa ee la soo bandhigo waa Xirmada Labba Khadka ah (DIP).Sida aad ka arki karto sawirka hoose, chip IC ee xirmadan waxay u egtahay senti-madow oo ka hooseeya safka labanlaabka ah ee biinanka, taasoo cajiib ah.Si kastaba ha noqotee, sababtoo ah inta badan waxay ka samaysan tahay caag, saameynta kuleylka kuleylka ayaa liidata mana buuxin karto shuruudaha jajabyada xawaaraha sare ee hadda jira.Sababtan awgeed, inta badan IC-yada loo isticmaalo xirmadan waa jajabyo waara, sida OP741 ee jaantuska hoose, ama IC-yada aan u baahnayn xawaare aad u badan oo leh jajabyo yaryar oo leh fiisooyin yar.
Chip-ka IC ee dhanka bidix waa OP741, cod-weyneeye koronto caadi ah.
IC ee bidix waa OP741, cod-weyneeye danab caadi ah.
Dhanka xirmada Ball Grid Array (BGA), way ka yar tahay xirmada DIP waxayna si fudud ugu geli kartaa aaladaha yaryar.Intaa waxaa dheer, sababtoo ah biinanka waxay ku yaalliin jibka hoostiisa, biinanka birta ah ayaa la dejin karaa marka la barbar dhigo DIP.Tani waxay ka dhigeysaa mid ku habboon jajabyada u baahan tiro badan oo xiriir ah.Si kastaba ha ahaatee, way ka qaalisan tahay habka isku xirka waa mid aad u adag, sidaas darteed inta badan waxaa loo isticmaalaa alaabooyinka qaaliga ah.